438
TEL:086-010-87581883
|
Main Technical Parameters |
||
|
Product Name |
3KWMedium Frequency CleaningPower Supply |
|
|
Product Model |
WT3-600V Medium Frequency CleaningPower Supply |
|
|
Product Brand |
Yochain |
|
|
Power Supply Type |
Fully Digital Controlled Intelligent Power Supply |
|
|
Input Voltage: |
AC220V±10 % |
|
|
Output |
Power: |
3KW |
|
Current: |
0~5A |
|
|
Voltage: |
Working Voltage200~ 600V, peak Voltage> 800V |
|
|
Frequency |
40Khz |
|
|
Wave Type |
Quasi-sine Wave |
|
|
mode |
custom Constant Voltage、Constant Current、Constant Power |
|
|
Adjustment Accuracy |
≤1 % |
|
|
Efficiency |
≥90 % |
|
|
Power factor |
cosΦ≥0.9 |
|
|
Control Mode: |
Power Supply Panel button Control |
|
|
AnalogSignal Control:TTL Electric flat , can Control Stop Working ,Output Voltage or Output Current or Output Power,External Open Circuit Protection( general Used for Water Flow Protection) |
||
|
Digital Interface Control:485Communication。AlsoCustom232Interface |
||
|
IoT Net WIFI Connection,Remote Net network Monitoring |
||
|
Display Mode: |
English LCD Display |
|
|
Display content : |
WorkingStatus,Output Voltage,Output Current, set value |
|
|
Output Protection |
Output overvoltage ,Output overcurrent ,Output malfunction |
|
|
Input Protection |
Input overvoltage ,Input undervoltage ,Input overcurrent , phase loss |
|
|
safe Protection |
GroundingProtection, leak Electric Protection, external control Protection, lightning protection Protection,Overheat |
|
|
Insulation Class |
B level |
|
|
Protection Class |
IP20 |
|
|
Protection response time |
1u S |
|
|
Input |
to HousingElectric resist |
≥20MΩ |
|
Output |
||
|
Input to HousingWithstand Voltage |
2000V/1min |
|
|
Input to Output Withstand Voltage |
3500V/1min |
|
|
OperatingEnvironment |
Temperature Degree: |
0~35 C |
|
Humidity: |
≤80 % |
|
|
CoolingMethod: |
Air Cooled |
|
|
Dimensions: |
480*95*370(mm ) |
|
|
Features : |
Volume Small ,Weight light , structure Simple,Easy to Operate,Stable and Reliable |
|
|
Circuit adopt Module chemical design ,DebuggingingRepair Convenient。 |
||
|
|
||
|
able platingInsulation film layer , notgenerate Electric arc , Load Suitable Range Wide |
||
|
Remarks: |
Factory Default Analog Interface and 485 Digital Interface |
|
|
Fault Prompt |
Intelligent Fault Testing Minute analysis , upper limit Fault Alarm, has Parameter Settingerror , human Operation error ,Power Supply internal factor multi-level error code sequence 。 |
|
|
|||
Medium Frequency Vacuum Cleaning Power Supply Application Field Description
Medium Frequency Vacuum Cleaning Power Supply is Vacuum plasma Surface Treatment Equipment of core dynamic Force source ,Operating Frequency usually set fixed in use 40k Hz for classic type value 。 phase compare at traditional of emit Frequency(RF)Power Supply,Medium Frequency Power Supply ingenerate High dense Degree、 Low damage damage of Plasma method face With unique Special advantage ,Special other Suitable for to surface uniform Nature require Pole High 、 base material heat sensitivity sense or need Depth Degree clean of industrial field view 。 its Application already wide permeation through to semiconductor 、Precision Electronic、 medical Device machine and advanced Manufacturingetc close key Field:
1. semiconductor seal install and micro Electronic Assembly
wafer level Cleaning : in wafer Cutting (Dicing )、 solid crystal (Die Bonding ) and lead Line bonding (Wire Bonding ) front , remove surface of has Machine pollutant 、 flux residue and Oxidation layer , display notable raise Liter core Sheet good rate 。
TSV and Flip-Chip Process:Pin to silicon through Hole(TSV) and pour install core Sheet of High Depth Wide compare structure ,Medium Frequency Plasma With more good of permeation through Nature, can Effective clear micro Hole bottom part of pollutant , accurate maintain interconnect Reliability。
Low medium Electric common number Materials Protection:Medium Frequency Dischargegenerate of ion can amount compare Low, can avoid to Low-k medium layer cause physical damage damage , is advanced system process of first select Cleaningscheme 。
2. High End PC B and F PC Manufacturing
remove drill pollution and Activation: in multi layer Board drill Hole after , utilize Medium Frequency Plasma remove Hole wall resin drilling pollution (Desmear), and Activation Hole wall surface , Large amplitude raise High Electroplating copper of combine Force, prevent Minute layer 。
resist solder paste front handle : in Sprayingresist solder paste front perform Surface Cleaningand Activation, eliminate except fingerprint 、 gray dust and Release Agent, increase strongink attach arrive Force, solve explosion Board、 up bubble problem 。
soft Nature Circuit Board(F PC )Cleaning :Pin to PI base material of heat sensitivity sense Nature,Medium Frequency Power Supply Provide of Temperature and Cleaning Environment can avoid base material change Typeor change color 。
3. medical Device machine and biological Materials
plant input Device machine surface modify Nature: to person work close save 、 heart Bracket、 guide tube etc plant input thing perform Cleaningand close water chemical handle , remove micro amount grease , raise High biological phase Nature and cell attach arrive rate 。
micro create hand technology tools Cleaning :Effective clear hand technology Device machine tube cavity internal of eggwhite residue 、 blood and Lubrication agent , accurate maintain sterilization effect , reduce Low sense contamination risk 。
micro flow control core Sheet bonding : in PDM Sorglass micro flow control core Sheet bondingfront , via Medium Frequency Plasma Activation surface , achieve room Temperature below of not can reverse bonding , no need High Temperature High Voltage。
4. auto vehicle Electronic and new can source part Piece
transmit sense Device and Connector Cleaning :Cleaning auto vehicle radar 、 camera Head modegroup and High Voltage Connector of metal touch point , remove Oxidation film and has Machine thing , accurate maintain signal transmission stable fixed and Low connect touch Electric resist 。
Battery Pole Sheet and film handle : in lithium Battery Manufacturing , remove Pole Sheet surface of dust and has Machine dissolve agent residue , raise Liter coatingcloth uniform Nature and Electrolysis liquid infiltration Nature。
vehicle Lamp and internal decoration Adhesive Bonding pre handle : replace replace chemical science bottom coatingagent , to PP、 PE etc difficult viscosity Plastic perform surface Activation, raise Liter vehicle Lamp Seal glue and internal decoration Piece of Adhesive Bonding Strength。
5. Precision Light science and Light Communication
mirror Head and Filter Cleaning : in Coating front remove mirror Sheet surface of micro amount has Machine pollutant , avoid Coatingafter appear “ hemp point ”or attach arrive Force notgood , raise Liter Light science element Piece of through over rate and exc Light damage damage threshold value 。
Light fiber Connector End face handle : clean Light fiber End face , reduce Low insert input damage consumption and return Wave damage consumption , accurate maintain Light signal transmission mass 。
6. 3C consumption Electronic and new Materials
hand Machine Housing and button Adhesive Bonding : toglass 、 ceramic and Metal Shell perform CleaningActivation, raise Liter pointglue 、 paste combine Process of Reliability, prevent Drop openglue 。
nano Meter Materials Minute dissipate front handle : in carbon nano Meter tube 、 graphene etc new Materials prepare over process , removegroup accumulate body surface of miscellaneous quality , improve Minute dissipate Nature。
Technical advantage Total result :
Medium Frequency Vacuum Cleaning Power Supply by means of its Discharge uniform Naturegood ( no emit Frequency Skin Effect)、 base Sheet Temperature Liter Low( fit heat sensitivity sense Materials)、Run Cost Low( no need Match Device,Maintenance Simple) and to complex structure wear through Force strongetc Features, become for modern High End Manufacturingindustry achieve nano Meter level clean and surface Functions chemical of close key Process equipment , help Force enterprise raise Liter Productgood rate 、 satisfy Environmental Friendly method rule and push dynamic Technical innovation 。
All Reviews (0)