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WZP5-5KV Medium Frequency High Voltage Impulse Power Supply, Plasma CleaningPower Supply

WZP5-5KV Medium Frequency High Voltage Impulse Power Supply | For cleaning, etching, activation, surface cleaning | 5KW
Price: $1846.1 $1846.1
WZP5-5KV Medium Frequency High Voltage Impulse Power Supply, Plasma CleaningPower Supply
  • Time: 2013-12-14
  • Weight:6.500kilogram
  • Serial number:G52AACA1864435
Rating:
100 %
0 comments
  • Input voltage:380V
  • Output power:5KW
  • Output voltage(Max):10KV
  • Output current(Max):800mA
  • Output frequency:25KHz
  • Custom:Yes
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Main Technical Parameters

Product Name

5KWMedium Frequency Plasma CleaningPower Supply

Product Model

WZP5-5KV

Product Brand

Yochain

Power Supply Type

Fully Digital Controlled Intelligent Power Supply,3 phase 4 Line

Input Voltage:

AC38010 %

Output

Power:

5KW

Current:

1A

Voltage:

5KV

Frequency

40K Hz

Wave Type

Quasi-sine Wave

mode

custom Constant Voltage、Constant Current、Constant Power

Adjustment Accuracy

1 %

Efficiency

90 %

Power factor

cosΦ≥0.9

Power Supply Switch

DB9Pin Interface

Control Mode:

Power Supply Panel button Control

AnalogSignal Control:TTL Electric flat , can Control Stop Working ,Output Voltage or Output Current or Output Power,External Open Circuit Protection( general Used for Water Flow Protection)

Digital Interface Control:485Communication。AlsoCustom232Interface

IoT Net WIFI Connection,Remote Net network Monitoring

Display Mode:

English LCD Display

Insulation Class

B level

Protection Class

IP20

Protection response time

1u S

Input

to HousingElectric resist

20MΩ

Output

Input to HousingWithstand Voltage

2000V/1min

Input to Output Withstand Voltage

3500V/1min

OperatingEnvironment

Temperature Degree:

035 C

Humidity:

85 %

CoolingMethod:

Air Cooled

Dimensions:

480*135*380(mm )

Features :

Volume Small ,Weight light , structure Simple,Easy to Operate,Stable and Reliable

Circuit adopt Module chemical design ,DebuggingingRepair Convenient。

Remarks:

Factory Default Analog Interface

Fault Prompt

Intelligent Fault Testing Minute analysis , upper limit Fault Alarm, has Parameter Settingerror , human Operation error ,Power Supply internal factor multi-level error code sequence 。

suitable Field

response Used for plasma Cleaning 、Etching 、 plasma plating 、 plasma coating 、 plasmagray chemical and surface modify Nature etc application 。 via its handle , able improve Materials surface of moisten wet can Force, make multi Type Materials able perform coating 、 platingetc Operation, increase strongviscosity combine Force、 bondingForce, meanwhile remove has Machine pollutant 、 oil pollution orgrease

plasma CleaningFeatures

·  can more Flexibleground Operation, simple thenground change handle Gas body of Type type and handle program 。

·  not can to Operation person member of body body cause any what damage harm 。

·  its Cost for plasma handle Method come say is micro not foot therapy of 。 

plasma CleaningMachine Application Range

·  semiconductor 、 micro Electronic

·  integrated Circuit Electronic Industry

·  Vacuum Electronic Industry

·  textile Industry

·  auto vehicle Industry

·  navigate empty aerospace

·  biological work process

·  medical science medical

·  Solar Battery Board

·  Plastic Rubber

·  Scientific Research open emit

·  archaeology science

 

Medium Frequency Vacuum Cleaning Power Supply Application Field Description

Medium Frequency Vacuum Cleaning Power Supply is Vacuum plasma Surface Treatment Equipment of core dynamic Force source ,Operating Frequency usually set fixed in use 40k Hz for classic type value 。 phase compare at traditional of emit Frequency(RF)Power Supply,Medium Frequency Power Supply ingenerate High dense Degree、 Low damage damage of Plasma method face With unique Special advantage ,Special other Suitable for to surface uniform Nature require Pole High 、 base material heat sensitivity sense or need Depth Degree clean of industrial field view 。 its Application already wide permeation through to semiconductor 、Precision Electronic、 medical Device machine and advanced Manufacturingetc close key Field:

1. semiconductor seal install and micro Electronic Assembly

wafer level Cleaning : in wafer Cutting (Dicing )、 solid crystal (Die Bonding ) and lead Line bonding (Wire Bonding ) front , remove surface of has Machine pollutant 、 flux residue and Oxidation layer , display notable raise Liter core Sheet good rate 。

TSV and Flip-Chip Process:Pin to silicon through Hole(TSV) and pour install core Sheet of High Depth Wide compare structure ,Medium Frequency Plasma With more good of permeation through Nature, can Effective clear micro Hole bottom part of pollutant , accurate maintain interconnect Reliability。

Low medium Electric common number Materials Protection:Medium Frequency Dischargegenerate of ion can amount compare Low, can avoid to Low-k medium layer cause physical damage damage , is advanced system process of first select Cleaningscheme 。

2. High End PC B and F PC Manufacturing

remove drill pollution and Activation: in multi layer Board drill Hole after , utilize Medium Frequency Plasma remove Hole wall resin drilling pollution (Desmear), and Activation Hole wall surface , Large amplitude raise High Electroplating copper of combine Force, prevent Minute layer 。

resist solder paste front handle : in Sprayingresist solder paste front perform Surface Cleaningand Activation, eliminate except fingerprint 、 gray dust and Release Agent, increase strongink attach arrive Force, solve explosion Board、 up bubble problem 。

soft Nature Circuit Board(F PC )Cleaning :Pin to PI base material of heat sensitivity sense Nature,Medium Frequency Power Supply Provide of Temperature and Cleaning Environment can avoid base material change Typeor change color 。

3. medical Device machine and biological Materials

plant input Device machine surface modify Nature: to person work close save 、 heart Bracket、 guide tube etc plant input thing perform Cleaningand close water chemical handle , remove micro amount grease , raise High biological phase Nature and cell attach arrive rate 。

micro create hand technology tools Cleaning :Effective clear hand technology Device machine tube cavity internal of eggwhite residue 、 blood and Lubrication agent , accurate maintain sterilization effect , reduce Low sense contamination risk 。

micro flow control core Sheet bonding : in PDM Sorglass micro flow control core Sheet bondingfront , via Medium Frequency Plasma Activation surface , achieve room Temperature below of not can reverse bonding , no need High Temperature High Voltage。

4. auto vehicle Electronic and new can source part Piece

transmit sense Device and Connector Cleaning :Cleaning auto vehicle radar 、 camera Head modegroup and High Voltage Connector of metal touch point , remove Oxidation film and has Machine thing , accurate maintain signal transmission stable fixed and Low connect touch Electric resist 。

Battery Pole Sheet and film handle : in lithium Battery Manufacturing , remove Pole Sheet surface of dust and has Machine dissolve agent residue , raise Liter coatingcloth uniform Nature and Electrolysis liquid infiltration Nature。

vehicle Lamp and internal decoration Adhesive Bonding pre handle : replace replace chemical science bottom coatingagent , to PP、 PE etc difficult viscosity Plastic perform surface Activation, raise Liter vehicle Lamp Seal glue and internal decoration Piece of Adhesive Bonding Strength。

5. Precision Light science and Light Communication

mirror Head and Filter Cleaning : in Coating front remove mirror Sheet surface of micro amount has Machine pollutant , avoid Coatingafter appear “ hemp point ”or attach arrive Force notgood , raise Liter Light science element Piece of through over rate and exc Light damage damage threshold value 。

Light fiber Connector End face handle : clean Light fiber End face , reduce Low insert input damage consumption and return Wave damage consumption , accurate maintain Light signal transmission mass 。

6. 3C consumption Electronic and new Materials

hand Machine Housing and button Adhesive Bonding : toglass 、 ceramic and Metal Shell perform CleaningActivation, raise Liter pointglue 、 paste combine Process of Reliability, prevent Drop openglue 。

nano Meter Materials Minute dissipate front handle : in carbon nano Meter tube 、 graphene etc new Materials prepare over process , removegroup accumulate body surface of miscellaneous quality , improve Minute dissipate Nature。

Technical advantage Total result :

Medium Frequency Vacuum Cleaning Power Supply by means of its Discharge uniform Naturegood ( no emit Frequency Skin Effect)、 base Sheet Temperature Liter Low( fit heat sensitivity sense Materials)、Run Cost Low( no need Match Device,Maintenance Simple)

and to complex structure wear through Force strongetc Features, become for modern High End Manufacturingindustry achieve nano Meter level clean and surface Functions chemical of close key Process equipment , help Force enterprise raise Liter Productgood rate 、 satisfy Environmental Friendly method rule and push dynamic Technical innovation 。

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